Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection
Da Yin, Qi Wang, Shihao Zhang, Baimei Tan, Fan Yang, Ru Wang, Xiaoqin Sun, Mengrui Liu
Topics & Concepts
CopperBenzotriazoleX-ray photoelectron spectroscopyChemical-mechanical planarizationEthylenediaminetetraacetic acidScanning electron microscopeElectrochemistryChemistrySurface roughnessMaterials scienceInorganic chemistryPolishingChemical engineeringNuclear chemistryMetallurgyChelationElectrodeComposite materialPhysical chemistryEngineeringAdvanced Surface Polishing TechniquesCorrosion Behavior and InhibitionAdvanced Machining and Optimization Techniques