Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration
Masaya Kawano
Abstract
This paper describes various packaging technologies and their trends for next generation heterogeneous integration. The new technologies fill the interconnect gap between chip and package to meet industry requirement of high density heterogeneous integration.
Topics & Concepts
InterconnectionIntegrated circuit packagingComputer scienceSystems engineeringChipSystem integrationChip-scale packageManufacturing engineeringTelecommunicationsEngineeringDatabase3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies