Thermal challenges in heterogeneous packaging: Experimental and machine learning approaches to liquid cooling
Ahmad R. Gharaibeh, Srikanth Rangarajan, Qusai Soud, Omar A. Alzubi, Yaman Manaserh, Bahgat Sammakia
Topics & Concepts
Computer coolingThermalMechanical engineeringMaterials scienceProcess engineeringEngineeringThermal management of electronic devices and systemsThermodynamicsPhysicsHeat Transfer and OptimizationElectronic Packaging and Soldering TechnologiesRefrigeration and Air Conditioning Technologies