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Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints

Qin Wang, Shanshan Cai, Shiyu Yang, Yongjian Yu, Yongkang Wan, Jubo Peng, Jiajun Wang, Xiaojing Wang

2024Journal of Materials Science Materials in Electronics21 citationsDOI

Topics & Concepts

SolderingMaterials scienceShear (geology)Composite materialMetallurgyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints | Litcius