High-performance ultra-thin loop heat pipe enabled by screen–printing technology for enhancing heat dissipation of electronic devices
Fangqiong Luo, Yang Wang, Y.-W. Lui, Jingjing Bai, Caiman Yan, Yuxin Wei, Wei Yuan, Shiwei Zhang, Yong Tang
Topics & Concepts
Thermal management of electronic devices and systemsDissipationMaterials scienceMechanical engineeringHeat pipeLoop (graph theory)Electrical engineeringEngineeringMechanicsHeat transferThermodynamicsPhysicsMathematicsCombinatoricsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationThermal properties of materials