Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction
Jae‐Won Lee, Eungchul Kim, Chulwoo Bae, Hyunho Seok, Jinil Cho, Kübra Aydın, Taesung Kim, Taesung Kim
Topics & Concepts
Materials scienceChemical-mechanical planarizationIsothermal processPolishingHydrogenOxideChemical engineeringDesorptionReducing atmosphereSlurryInorganic chemistryAbrasiveMetallurgyComposite materialAdsorptionPhysical chemistryChemistryOrganic chemistryEngineeringThermodynamicsPhysicsAdvanced Surface Polishing TechniquesAdvanced materials and compositesMetal Extraction and Bioleaching