A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
Han Yan, Xinhuan Niu, Minghui Qu, Fu Luo, Ni Zhan, Jianghao Liu, Yida Zou
Topics & Concepts
Chemical-mechanical planarizationSlurryInterconnectionPolishingWaferMaterials scienceIntegrated circuitCopper interconnectCopperProcess engineeringNanotechnologyMetallurgyComputer scienceEngineeringComposite materialOptoelectronicsComputer networkAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisDiamond and Carbon-based Materials Research