Sintering and optimization of copper nanopaste-connected copper array conical microstructures
Hongliang Lyu, Cong Wang, Kai Li, Xianshi Jia, Jiahua He, Dejin Yan, Nai Lin, Ji’an Duan
Topics & Concepts
Materials scienceCopperSinteringMicrostructureConical surfaceMetallurgyComposite materialElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties