Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints
Mohammad Ghaleeh, Ahmad Baroutaji, Mansour Al Qubeissi
Topics & Concepts
SolderingMaterials scienceBall grid arrayMicrostructureIsothermal processTemperature cyclingMetallurgyAlloyReliability (semiconductor)Stress (linguistics)Solder pasteComposite materialThermalPhysicsPhilosophyMeteorologyPower (physics)ThermodynamicsLinguisticsQuantum mechanicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesFatigue and fracture mechanics