Crack damage control for diamond wire sawing of silicon: The selection of processing parameters
Mengran Ge, Zibin Chen, Peizhi Wang, Peiqi Ge
Topics & Concepts
Materials scienceWaferWafer dicingDiamondDeflection (physics)Composite materialStructural engineeringSiliconMetallurgyOpticsOptoelectronicsEngineeringPhysicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization