Microstructure design to achieve optimal strength, thermal stability, and electrical conductivity of Al-7.5wt.%Y alloy
Mengmeng Wang, Mengmeng Wang, Marko Knežević, Ming Chen, Jiansheng Li, Tong Liu, Gang Wang, Yu Zhao, Miao Wang, Miao Wang, Qi Liu, Zhongjia Huang, Dafan Du, Haiyan Gao, Jun Wang, Baode Sun
Topics & Concepts
Materials scienceIntermetallicEutectic systemAnnealing (glass)MicrostructureAlloyNucleationGrain boundaryThermal conductivityComposite materialMetallurgyGrain sizeThermodynamicsPhysicsAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesMicrostructure and mechanical properties