Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol
Xiaocun Wang, Shuo Han, Fei Xiao
Topics & Concepts
CopperIn situGlycerolCopper oxideOxideChemistryMaterials scienceInorganic chemistryReduction (mathematics)Direct bondingMetallurgyChemical engineeringOrganic chemistryEngineeringMathematicsGeometrySilicon3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability