Electroless plating of a 5G copper antenna on polyimide patterned with laser-induced selective activation and curing of metal–organic catalyst
Jhu‐Lin You, Chang-Pin Chang, Nen‐Wen Pu, Yi-Shin Chen, Ling-Hsuan Wang, Kun-Hung Pan, Ming-Der Ger
Topics & Concepts
Materials scienceCopperPolyimideCopper platingPalladiumCuring (chemistry)CatalysisLaserSubstrate (aquarium)Composite materialChemical engineeringLayer (electronics)MetallurgyOpticsChemistryOrganic chemistryElectroplatingPhysicsEngineeringOceanographyGeology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologies