Ground fused silica processed by combined chemical etching and CO<sub>2</sub> laser polishing with super-smooth surface and high damage resistance
Zhen Cao, Chaoyang Wei, Xin Cheng, Yuanan Zhao, Xiaocong Peng, Zhigang Jiang, Jianda Shao
Abstract
Laser damage in fused silica, particularly ultraviolet laser damage, is still a key problem limiting the development of high-power laser systems. In this Letter, a combined process of chemical etching and <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"> <mml:mrow class="MJX-TeXAtom-ORD"> <mml:msub> <mml:mrow class="MJX-TeXAtom-ORD"> <mml:mrow class="MJX-TeXAtom-ORD"> <mml:mi mathvariant="normal">C</mml:mi> <mml:mi mathvariant="normal">O</mml:mi> </mml:mrow> </mml:mrow> <mml:mn>2</mml:mn> </mml:msub> </mml:mrow> </mml:math> laser polishing was applied to ground fused silica. A super-smooth surface with a root-mean-square roughness of 0.25 nm was achieved through this combined process. Furthermore, the combined process can reduce the introduction of photoactive metal impurity elements, destructive defects, and chemical-structure defects, resulting in a 0% probability damage threshold nearly 33% higher than a conventional chemical mechanical polished sample for a 7.6 ns pulse at a wavelength of 355 nm.