Pool boiling enhancement in electrodeposited copper capillary wicks: Staggered pore configuration versus straight through-hole design
Mou Xu, Shuang-Fei Li, Jiali Luo, Yi-Ying Bao, Dong-Chuan Mo, Shu‐Shen Lyu
Topics & Concepts
CopperMaterials scienceCapillary actionBoilingComposite materialMechanicsMetallurgyThermodynamicsPhysicsHeat Transfer and Boiling StudiesElectronic Packaging and Soldering TechnologiesFluid Dynamics and Thin Films