Litcius/Paper detail

Enhanced wettability in ultrasonic-assisted soldering to glass substrates

Caleb Wilson, Lonny L. Thompson, Hongseok Choi, Joshua B. Bostwick

2021Journal of Manufacturing Processes12 citationsDOI

Topics & Concepts

SolderingMaterials scienceWettingSurface tensionComposite materialUltrasonic sensorCapillary actionAcoustic levitationSubstrate (aquarium)Mechanical engineeringAcousticsThermodynamicsLevitationEngineeringPhysicsMagnetGeologyOceanographyElectronic Packaging and Soldering TechnologiesUltrasound and Cavitation PhenomenaMetallurgical Processes and Thermodynamics