Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper
Minghui Zhang, Li‐Yin Gao, Junjie Li, Rong Sun, Zhi‐Quan Liu
Topics & Concepts
CopperMaterials scienceScanning electron microscopeHigh-resolution transmission electron microscopyElectron backscatter diffractionTransmission electron microscopyDiffusion bondingCrystalliteThermal diffusivityComposite materialMetallurgyMicrostructureAnalytical Chemistry (journal)NanotechnologyChemistryPhysicsChromatographyQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties