Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding
Emilie Bourjot, Alice Bond, Noura Nadi, T. Enot, Loïc Sanchez, Pierre Montméat, Benoı̂t Martin, Alain Campo, Frank Fournel, Feras Eid, Johanna Swan
Abstract
We report the integration and process challenges of self assembly in die-to-wafer hybrid bonding. The bonding quality, step height and Cu integrity are discussed in the context of technology implementation in high volume manufacturing. In-depth characterizations of surfaces and bonding structures are performed and used to propose process improvements.
Topics & Concepts
Die (integrated circuit)WaferWafer bondingContext (archaeology)Process (computing)Wire bondingMaterials scienceAnodic bondingMechanical engineeringManufacturing engineeringComputer scienceEngineering drawingEngineeringNanotechnologyElectrical engineeringPaleontologyOperating systemBiologyChip3D IC and TSV technologiesModular Robots and Swarm IntelligenceElectronic Packaging and Soldering Technologies