Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging
Xianwen Peng, Yue Wang, Zheng Ye, Jihua Huang, Jian Yang, Shuhai Chen, Xingke Zhao
Topics & Concepts
Materials scienceSinteringMicrostructureDifferential scanning calorimetryComposite materialShear strength (soil)Phase (matter)Anodic bondingTinJoint (building)Layer (electronics)MetallurgyChemistrySoil waterPhysicsOrganic chemistryThermodynamicsEngineeringSoil scienceArchitectural engineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties