Mechanism and regulation of thermal damage on picosecond laser modification dicing of SiC wafer
Fu Liu, Jing Xu, Sineng Yan, Yubiao Zhou, Yi Zhang
Topics & Concepts
Wafer dicingWaferMechanism (biology)Materials scienceThermalPicosecondOptoelectronicsLaserOpticsEpistemologyMeteorologyPhysicsPhilosophyLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure Analysis