Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys
Bismarck Luiz Silva, Guilherme Lisboa de Gouveia, Noé Cheung, Amauri Garcia, José Eduardo Spinelli
Topics & Concepts
WettingMaterials scienceSolderingAlloyContact angleMetallurgyThermal diffusivityAtmospheric temperature rangeThermodynamicsComposite materialPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties