Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application
Weijie Hong, Li-Li Yuan, Haoyang Zhang, Chao Cui, Wei Chen, Shiyong Yang
Topics & Concepts
DiluentThermosetting polymerMaterials sciencePolymer chemistryCuring (chemistry)MoietyMelting temperaturePolyimideMolding (decorative)Reactive extrusionThermal stabilityComposite materialPolymerChemical engineeringChemistryOrganic chemistryEngineeringLayer (electronics)Synthesis and properties of polymersEpoxy Resin Curing ProcessesN-Heterocyclic Carbenes in Organic and Inorganic Chemistry