Effect of cations on the improvement of material removal rate of silicon wafer in chemical mechanical polishing

Wenxiang Xie, Zhenyu Zhang, Xin Chen, Shiqiang Yu, Chunjing Shi, Hongxiu Zhou, Wei Wen

2023Colloids and Surfaces A Physicochemical and Engineering Aspects18 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationWaferMaterials scienceMicroelectronicsNanometrePolishingX-ray photoelectron spectroscopySlurrySiliconSurface roughnessNanotechnologySemiconductorIonChemical engineeringComposite materialOptoelectronicsChemistryOrganic chemistryEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications