Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength
S. F. N. Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Nurul Razliana Abdul Razak, Hideyuki Yasuda, Jitrin Chaiprapa, Kazuhiro Nogita
Topics & Concepts
SolderingMaterials scienceMicrostructureIntermetallicShear strength (soil)MetallurgySurface finishJoint (building)Composite materialSurface roughnessAlloyArchitectural engineeringEnvironmental scienceEngineeringSoil scienceSoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability