5-Amino-1,3,4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies
Miaomiao Zhou, Yachao Meng, Jingwei Ling, Yu Zhang, Wei Huang, Yulin Min, Xixun Shen, Qunjie Xu
Topics & Concepts
CopperElectrochemistryAdsorptionDiffractometerElectroplatingPrinted circuit boardThioureaElectrolyteChemistryDensity functional theoryMaterials scienceElectrodeNanotechnologyChemical engineeringCrystal structureCrystallographyComputational chemistryPhysical chemistryOrganic chemistryLayer (electronics)Computer scienceOperating systemEngineeringElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCorrosion Behavior and Inhibition