Recent advances in atomic layer deposition of superconducting thin films: a review
Getnet Kacha Deyu, Marc Wenskat, Isabel González Díaz-Palacio, Robert H. Blick, Robert Zierold, W. Hillert
Abstract
The development of superconducting thin films has opened new avenues in electronic and quantum technologies, offering potential breakthroughs in performance due to their unique properties such as zero electrical DC resistance and perfect diamagnetism. Atomic layer deposition (ALD) stands out as a highly precise and uniform technique for fabricating these films based on sequential, and self-limiting gas-solid surface reactions, offering distinct advantages over other deposition methods. This review explores the role of ALD in the production of superconducting thin films, highlighting its ability to control film thickness at the atomic level, ensuring superior uniformity and conformality. The fundamentals of superconductors and the ALD process are discussed, along with a review of various materials used in the field. It also examines the existing and potential applications of these films and considers future prospects and challenges in the field.