Recent Advances in Electroplating of Through-Hole Copper Interconnection
Yuanhang Zhang, Maozhong An, Peixia Yang, Jinqiu Zhang
Topics & Concepts
ElectroplatingInterconnectionMaterials scienceCopper platingProcess engineeringMetallurgyComputer scienceLayer (electronics)NanotechnologyEngineeringTelecommunicationsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability