Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints
Yi-Wun Wang
Topics & Concepts
SolderingMaterials scienceInterconnectionPorosityMiniaturizationComposite materialReflow solderingSolder pasteJoint (building)DiffusionNanotechnologyComputer sciencePhysicsEngineeringThermodynamicsComputer networkArchitectural engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability