Formulation of a paste for copper thick film
Jiayu Tang, Cheuk Hei Herry Mak, Sze Kee Tam, Ka Ming Ng
Topics & Concepts
Materials scienceCopperSinteringInertElectrical resistivity and conductivityElectrical conductorComposite materialInert gasVolume (thermodynamics)Surface-area-to-volume ratioNanoparticleSubstrate (aquarium)MetallurgyConductivityMetalChemical engineeringNanotechnologyGeologyElectrical engineeringEngineeringPhysicsOceanographyPhysical chemistryQuantum mechanicsChemistryAdvanced Sensor and Energy Harvesting MaterialsConducting polymers and applicationsNanomaterials and Printing Technologies