The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder
Xin Gu, Hailong Bai, Dongdong Chen, Lingyan Zhao, Jianhong Yi, Xiang Liu, Jikang Yan
Topics & Concepts
Materials scienceSolderingMicrostructureMelting pointScanning electron microscopeAlloyDifferential scanning calorimetryMetallurgyNanoparticleSolder pasteOptical microscopeComposite materialNanotechnologyPhysicsThermodynamicsElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties