Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
Runding Luo, Dong Hu, Cheng Qian, Xu Liu, Xuejun Fan, Guoqi Zhang, Jiajie Fan
Topics & Concepts
SinteringMaterials scienceMicrostructureUltimate tensile strengthComposite materialShear strength (soil)Shear modulusMolecular dynamicsSoil scienceComputational chemistryChemistrySoil waterEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies