Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging
Hu Zhang, Xiaoyan Li, Peng Yao, Linjie Wen, Yangyang Zhu, Xi He, Gangli Yang
Topics & Concepts
Materials scienceIntermetallicMicrostructureGrain sizeUltimate tensile strengthPhase (matter)Vickers hardness testElectron backscatter diffractionMetallurgyComposite materialGrain growthAlloyOrganic chemistryChemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties