Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies
Vincent S. D. Voet, Frederik Van Loock, Christophe De Fruytier, Aude Simar, Thomas Pardoen
Topics & Concepts
SolderingPrinted circuit boardViscoplasticityCrackingMaterials scienceFinite element methodJoint (building)Reliability (semiconductor)ThermalComposite materialElectronic componentTraction (geology)Thermal expansionElectronic packagingStructural engineeringTemperature cyclingComponent (thermodynamics)InterconnectionMechanical engineeringEngineeringConstitutive equationElectrical engineeringPower (physics)ThermodynamicsPhysicsQuantum mechanicsTelecommunicationsMeteorologyElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties