Feasibility analysis of EICP technique for reinforcing backfill layer behind TBM tunnel linings based on model tests
Ming Huang, Qiwu Jiang, Kai Xu, Chaoshui Xu
Topics & Concepts
Geotechnical engineeringLayer (electronics)EngineeringStructural engineeringMaterials scienceComposite materialMicrobial Applications in Construction MaterialsGrouting, Rheology, and Soil MechanicsGeotechnical Engineering and Underground Structures