Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications
Zihao Lin, Zhijian Sun, Wenbin Fu, Yu-Chieh Lin, Kyoung‐sik Moon, C.P. Wong
Topics & Concepts
Materials scienceFiller (materials)Composite materialEpoxyElectrical conductorElectrically conductiveElectronic packagingThermal properties of materialsMechanical Behavior of CompositesSynthesis and properties of polymers