Molecular Dynamics Study of Nano-Grinding Behavior for Silicon Wafer Workpieces with Nanoscale Roughness Under Diamond Abrasive Rotation and Translation
Bing Wu, Yunyun Sun, Shijing Wu
Topics & Concepts
GrindingMaterials scienceAbrasiveWaferSurface roughnessSurface finishDiamondSiliconNanoscopic scaleNano-Root mean squareComposite materialMetallurgyNanotechnologyElectrical engineeringEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization