Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN
Hongjiang Qian, Jiebin Shen, Zhiyong Huang, Jian Wang, Qingyun Zhu, Zeshuai Shen, Haidong Fan
Topics & Concepts
Materials scienceComposite materialDeformation (meteorology)ThermalEnergy densityStructural engineeringMechanical engineeringEngineering physicsThermodynamicsEngineeringPhysicsNumerical methods in engineering3D IC and TSV technologiesAluminum Alloys Composites Properties