Investigations on the mechanism of silica particle removal during the Cu buff cleaning process
Pengzhan Liu, Seok‐Jun Hong, Sanghuck Jeon, Jaewon Lee, Donggeon Kwak, Yutaka Wada, Hirokuni Hiyama, Satomi Hamada, Taesung Kim
Topics & Concepts
van der Waals forceAdhesionParticle (ecology)PolishingMaterials scienceChemical-mechanical planarizationChemical engineeringProcess (computing)NanotechnologyComposite materialMetallurgyChemistryMoleculeComputer scienceEngineeringGeologyOceanographyOrganic chemistryOperating systemAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdhesion, Friction, and Surface Interactions