Improved microstructure, mechanical properties and electrical conductivity of the Cu–Ni–Sn–Ti–Cr alloy due to Ce micro-addition
Shunlong Tang, Meng Zhou, Yi Zhang, Deye Xu, Zhiyang Zhang, Xianhua Zheng, De Li, Xu Li, Baohong Tian, Yanlin Jia, Yong Liu, Alex A. Volinsky, Ekaterina S. Marchenko
Topics & Concepts
Materials scienceAlloyUltimate tensile strengthMicrostructureMetallurgyPrecipitationElectrical resistivity and conductivityPrecipitation hardeningElongationGrain boundaryTexture (cosmology)Composite materialImage (mathematics)Electrical engineeringMeteorologyPhysicsEngineeringComputer scienceArtificial intelligenceAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAdvanced materials and composites