Coupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density
Bin Ding, Zhihao Zhang, Liang Gong, Chuanyong Zhu, Minghai Xu
Topics & Concepts
Materials scienceCoupling (piping)Power densityThermal management of electronic devices and systemsThermalPower (physics)Stress (linguistics)MechanicsComposite materialThermodynamicsMechanical engineeringPhysicsPhilosophyEngineeringLinguistics3D IC and TSV technologiesSemiconductor materials and devicesThin-Film Transistor Technologies