Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison
Jens Heilmann, Bernhard Wunderle, Uwe Zschenderlein, Catharina Wille, K. Pressel
Topics & Concepts
Physics of failureDie (integrated circuit)Reliability (semiconductor)Power electronicsTemperature cyclingAccelerated life testingElectronicsMechanical engineeringContext (archaeology)BendingElectronic packagingMaterials scienceReliability engineeringEngineeringPower (physics)ThermalElectronic engineeringStructural engineeringElectrical engineeringPhysicsVoltageDevelopmental psychologyMaturity (psychological)PaleontologyPsychologyMeteorologyQuantum mechanicsBiologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis