Litcius/Paper detail

Research on heat transfer and flow distribution of parallel-configured microchannel heat sinks for arrayed chip heat dissipation

Chengyu Hu, Xiaoping Yang, Zihuan Ma, Xiang Ma, Yali Feng, Jinjia Wei

2024Applied Thermal Engineering34 citationsDOI

Topics & Concepts

MicrochannelHeat sinkHeat transferThermal management of electronic devices and systemsMechanicsMaterials scienceChipFlow (mathematics)DissipationMechanical engineeringThermodynamicsEngineeringPhysicsElectrical engineeringHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms