Undeformed chip thickness with composite ultrasonic vibration-assisted face grinding of silicon carbide: Modeling, computation and analysis
Qihui Cheng, Chenwei Dai, Qing Miao, Zhen Yin, Jiajia Chen, Shengjun Yang
Topics & Concepts
Materials scienceGrindingSurface roughnessBrittlenessMachiningComposite materialUltrasonic sensorSilicon carbideChip formationSurface finishSurface integrityMetallurgyTool wearAcousticsPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques