Suppression strategy for process-induced warpage of novel fan-out wafer level packaging
Ching-Feng Yu, Yu-Wei Huang, Tsung-Yu Ouyang, Shau-Fei Cheng, Hsiang‐Hung Chang, Chih-Cheng Hsiao
Topics & Concepts
Fan-outWafer-level packagingInterposerFabricationElectronic engineeringEngineeringTemperature cyclingFinite element methodWaferMaterials scienceMechanical engineeringLayer (electronics)Electrical engineeringStructural engineeringThermalComposite materialEtching (microfabrication)Alternative medicineMedicineMeteorologyPhysicsPathologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanofabrication and Lithography Techniques