Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package
Guigen Ye, Xuejun Fan, Guoqi Zhang
Topics & Concepts
Finite element methodOrthotropic materialBenchmark (surveying)ViscoplasticityPoint (geometry)Representation (politics)Structural engineeringNonlinear systemMechanical engineeringElectronic packagingComputer scienceEngineeringElectronic engineeringMathematicsGeometryConstitutive equationPhysicsLawPolitical sciencePoliticsGeodesyGeographyQuantum mechanicsComposite Material MechanicsElectronic Packaging and Soldering Technologies