Litcius/Paper detail

Effects of different sizes and cutting-edge heights of randomly distributed tetrahedral abrasive grains on 3C–SiC nano grinding

Xiuting Zhao, Ziyue Wang, Chuntao Zheng, Chong Yue

2024Materials Science in Semiconductor Processing13 citationsDOI

Topics & Concepts

AbrasiveMaterials scienceGrindingEnhanced Data Rates for GSM EvolutionTetrahedronAmorphous solidPhase (matter)DislocationNano-Composite materialCrystallographyOrganic chemistryChemistryComputer scienceTelecommunicationsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research