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High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications

Hongqiang Zhang, Hailin Bai, Qiang Jia, Wei Guo, Lei Liu, Guisheng Zou

2020Acta Metallurgica Sinica (English Letters)65 citationsDOI

Topics & Concepts

Materials scienceSinteringMicrostructureComposite materialScanning electron microscopeShear strength (soil)Electrical resistivity and conductivityTransmission electron microscopyThermal conductivityLayer (electronics)MetallurgyNanotechnologySoil waterElectrical engineeringSoil scienceEngineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications | Litcius