A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current
Weien Yu, Chaoyu Lin, Qingyang Li, Jinqiu Zhang, Peixia Yang, Maozhong An
Topics & Concepts
CopperCurrent collectorCopper platingMaterials scienceFOIL methodComposite numberBattery (electricity)Direct currentCurrent densityMetallurgyElectrolyteComposite materialElectroplatingChemistryVoltageElectrodeLayer (electronics)Power (physics)PhysicsQuantum mechanicsPhysical chemistryElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionNanoporous metals and alloys