Experimental and computational investigation of complexing agents on copper dissolution for chemical mechanical polishing process
Lianjun Hu, Guofeng Pan, Qi Chen, Lipeng Li, Yunpeng Ma, Yong Zhang
Topics & Concepts
CopperChemical-mechanical planarizationDissolutionChemistryInorganic chemistryOxideX-ray photoelectron spectroscopyChelationCarboxylateHydroxidePolishingDensity functional theoryMaterials scienceChemical engineeringLayer (electronics)Physical chemistryOrganic chemistryMetallurgyComputational chemistryEngineeringAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisMetal Extraction and Bioleaching