Litcius/Paper detail

Review of ultrasonic-assisted soldering in Sn-based solder alloys

Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Lili Gao, Meng Zhao, Sujuan Zhong

2023Journal of Materials Science Materials in Electronics19 citationsDOI

Topics & Concepts

SolderingSolderabilityMaterials scienceUltrasonic sensorMetallurgyBrazingWave solderingMechanical engineeringAlloyEngineeringAcousticsPhysicsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies
Review of ultrasonic-assisted soldering in Sn-based solder alloys | Litcius